Cem500 Cem501 Cem511 Cem521 COM Express Type 6 Motherboard for Axiomtek

• Customization: Available
• Integrated Graphics: Integrated Graphics
• Main Chipset: Intel
• Model NO.: Cem500, CEM501, CEM511, CEM521
• Maximum Memory Capacity: 64G
• Structure: COM Express Type 6
• Memory: DDR4
• SATA Interface: SATA3.0
• Printed Circuit Board: Double Layers
• Main Board Structure: Circuit Baded
• Audio Effects: Not HiFi
• Chipset Manufacturer: Intel
• with CPU: Yes
• Socket Type: Onboard CPU
• Chipset: Soc Integrated
• CPU Type: Intel
• Hard Drive Interface: SATA
• Item Condition: New
• Memory Channel: Double
• Products Status: New
• Memory Bank: 2DDR4DIMM
• Package: Yes
• Private Mold: Yes
• Application: Server/Workstation
• Launch Date: 2020
• Transport Package: Std
• Specification: 95 x 95 mm
• Trademark: Axiomtek
• Origin: Bj. Cn
• Production Capacity: 1000pieces Per Year

Product Description

Ordering Information

CEM500

• CEM500PG-E3-1505M+CM236 (P/N-E38D500109)
• COM Express Type 6 basic module with Intel® Xeon® E3-1505M v5 2.8 GHz, CM236, ECC, DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM500PG-i3-6100E+CM236 (P/N-E38D500105)
• COM Express Type 6 basic module with Intel® Core™ i3-6100E 2.7 GHz, CM236, ECC, DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM500PG-i7-6822EQ+QM170 (P/N-E38D500106)
• COM Express Type 6 basic module with Intel® Core™ i7-6822EQ 2.0 GHz, QM170, DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM500PG-i7-6820EQ+QM170 (P/N-E38D500100)
• COM Express Type 6 basic module with Intel® Core™ i7-6820EQ 2.8 GHz, QM170 DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM500PG-i5-6440EQ+QM170 (P/N-E38D500101)
• COM Express Type 6 basic module with Intel® Core™ i5-6440EQ 2.7 GHz, QM170 DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM500PG-i3-6100E+QM170 (P/N-E38D500108)
• COM Express Type 6 basic module with Intel® Core™ i3-6100E 2.7 GHz, QM170 DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEB94011 (P/N-E394011100)
• ATX form factor Type 6 evaluation board
• TS008-CEM500 (P/N-E39J008100)
• CEM500 heat sink with fan
• TS006-CEM500 (P/N-E39J006100)
• CEM500 Heatspreader

CEM501

• CEM501PG-CEL-3955U (P/N-E38D501100)
• COM Express Type 6 compact module Intel® Celeron® 3955U (2.0 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM501PG-i7-6600U (P/N-E38D501102)
• COM Express Type 6 compact module with Intel® Core™ i7-6600U (2.6 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM501PG-i5-6300U (P/N-E38D501103)
• COM Express Type 6 compact module with Intel® Core™ i5-6300U (2.4 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEM501PG-i3-6100U (P/N-E38D501101)
• COM Express Type 6 compact module with Intel® Core™ i3-6100U (2.3 GHz), DDI/LVDS, GbE LAN, USB 3.0 and TPM
• CEB94011 (P/N-E394011100)
• CEB94011 COM Express Type 6 evaluation board
• TS007-CEM501 (P/N-E39J007100)
• CEM501 heat sink with fan
• 5078D501200E
• CEM501 heat spreader

 

CEM511

• CEM511PG-i7-7600U (P/N-E38D511102)
• COM Express Type 6 Compact module with Intel® Core™ i7-7600U, DDI, LVDS, GbE LAN, USB 3.0 and TPM
• CEM511PG-i5-7300U (P/N-E38D511101)
• COM Express Type 6 Compact module with Intel® Core™ i5-7300U, DDI, LVDS, GbE LAN, USB 3.0 and TPM
• CEM511PG-i3-7100U (P/N-E38D511100)
• COM Express Type 6 Compact module with Intel® Core™ i3-7100U, DDI, LVDS, GbE LAN, USB 3.0 and TPM
• CEM511PG-Cel-3965U (P/N-E38D511103)
• COM Express Type 6 Compact module with Intel® Celeron® 3965U, DDI, LVDS, GbE LAN, USB 3.0 and TPM
• CEB94011 (P/N-E394011100)
• COM Express Type 6 application board
• 7108D511000E
• CEM511 heat sink with fan
• 5078D501200E
• CEM511 heat spreader

CEM521

• CEM521-i7-8665UE (P/N-E38D521100)
• COM Express Type 6 Compact module with Intel® Core™ i7-8665UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM
• CEM521-i5-8365UE (P/N-E38D521102)
• COM Express Type 6 Compact module with Intel® Core™ i5-8365UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM
• CEM521-i3-8145UE (P/N-E38D521104)
• COM Express Type 6 Compact module with Intel® Core™ i3-8145UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM
• CEM521-Cel-4305UE (P/N-E38D521105)
• COM Express Type 6 Compact module with Intel® Celeron® 4305UE, DDI, VGA, LVDS, GbE LAN, USB 3.0 and TPM
• CEM521-i7-8665UE (Ind.) (P/N-E38D521110)
• COM Express Type 6 compact module with Intel® Core™ i7-8665UE DDI VGA LVDS GbE LAN USB 3.0 and TPM (wide temperature)
• CEM521-i5-8365UE (Ind.) (P/N-E38D521111)
• COM Express Type 6 compact module with Intel® Core™ i5-8365UE DDI VGA LVDS GbE LAN USB 3.0 and TPM (wide temperature)
• CEM521-i3-8145UE (Ind.) (P/N-E38D521112)
• COM Express Type 6 compact module with Intel® Core™ i3-8145UE DDI VGA LVDS GbE LAN USB 3.0 and TPM (wide temperature)
• CEB94011 (P/N-E394011100)
• COM Express Type 6 evaluation board
• E39J016100
• CEM521 heat sink with fan
• 7128D521000E
• CEM521 heat spreader

Product Description

CEM500
COM Express Type 6 Basic Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170

Features

• 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H)
• Intel® CM236/QM170/HM170 chipset
• 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC
• 1 x PCIe x16 and 8 x PCIe x1 Gen. 3
• 4 SATA-600 with RAID 0/1/5/10
• 4 USB 3.0 and 8 USB 2.0
• Intel® AMT 11.0 and TPM function supported
• AXView 2.0 intelligent remote management software

Specifications

CPU	Intel® Xeon® and 6th generation Intel® Core™ processor (Skylake H): E3-1505M v5 (45 W), i7-6820EQ (45 W), i7-6822EQ (25 W), i5-6440EQ (45 W), i3-6100E (35 W)
Chipset	Intel® CM236/QM170/HM170
System Memory	2 x DDR4-2133 SO-DIMM ECC or non-ECC, up to 32GB
BIOS	AMI
Serial	2 x TX/RX
USB	4 x USB 3.0 8 x USB 2.0
Ethernet	1 x 10/100/1000 Mbps (Intel® i219LM)
Display	1 x LVDS ;18/24-bit single/dual channel (default), optional with eDP 1 x VGA up to 1920 x 1200 @60Hz (default) 2 x DDI (DP/HDMI/DVI)
GPIO	4-IN & 4-OUT
Audio	HD link interface to baseboard for Codec
Storage	4 x SATA-600 with RAID 0/1/5/10
Expansion	1 x PCIe x16 8 x PCIe x1
Others	1 x LPC interface 1 x SPI interface 1 x I2C interface
Battery	N/A
Power Input	ATX: +12V, +5VSB AT: +12V
Watchdog Timer	65536 levels, 0~65535 sec.
Hardware Monitoring	Yes
Operating Temperature	-40ºC ~ +85ºC (-40ºF ~ +185ºF)
Relative Humidity	10% ~ 95% relative humidity, non-condensing
Dimensions	125 x 95 mm
Board Thickness	2.0 mm
Certifications	CE

CEM501
COM Express Type 6 Compact Module with 6th Gen Intel Core i7/i5/i3 and Celeron Processor

Features
6th gen Intel Core i7/i5/i3 and Celeron processors (Skylake-U)
2 DDR4-2133 SO-DIMM, up to 32GB
Max. up to 6 lanes of PCI Express
3 SATA-600
4 USB 3.0 and 8 USB 2.0
AXView 2.0 intelligent remote management software
TPM 1.2 supported

Introduction
The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel Core i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, and IoT related applications.

Specifications
 

CPU	6th generation Intel® Core™ processor: i7-6600U 2.6 GHz, i5-6300U 2.4 GHz, i3-6100U 2.3 GHz onboard Intel® Celeron®-3955U 2.0 GHz onboard
Chipset	SoC integrated
System Memory	2 x 260-pin SO-DIMM DDR4-2133 up to 32 GB
BIOS	AMI
Serial	2 x Serial TX/RX
USB	4 x USB 3.0 8 x USB 2.0
Ethernet	1 x 10/100/1000 Mbps (Intel® i219LM)
Display	2 x DDI (DisplayPort/HDMI/DVI); 1 DDI optional with VGA 1 x LVDS; 18/24-bit dual channel (eDP optional)
GPIO	4-IN & 4-OUT (SDIO optional)
Audio	HD link interface to baseboard for Codec
Storage	3 x SATA-600
Expansion	6 lanes of PCI Express Gen. 3.0
Others	1 x LPC interface 1 x SPI interface 1 x I2C
Battery	N/A
Power Input	ATX: +12V, +5VSB AT: +12V
Watchdog Timer	65536 levels, 0 ~ 65535 sec.
Hardware Monitoring	Yes
Operating Temperature	-40°C ~ +85°C (-40°F ~ +185°F)
Relative Humidity	10% ~ 95% relative humidity, non-condensing
Dimensions	95 x 95 mm
Board Thickness	2.0 mm
Certifications	CE

CEM511
COM Express Type 6 Compact Module with 7th Gen Intel® Core™ & Celeron® Processor

Features

• 7th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Kaby Lake-U)
• 2 DDR4-2133 SO-DIMM for up to 32GB of memory
• Max. up to 6 lanes of PCI Express
• 3 SATA-600
• 4 USB 3.0 and 8 USB 2.0
• TPM 1.2 supported
• AXView 2.0 intelligent remote management software

Specifications

CPU	Intel® Core™ i7-7600U/i5-7300U/i3-7100U processor (Kaby Lake-U) & Intel® Celeron® processor 3965U
Chipset	SoC integrated
System Memory	2 x 260-pin SO-DIMM DDR4-2133, up to 32GB
BIOS	AMI
Serial	2 x TX/RX
USB	4 x USB 3.0 8 x USB 2.0
Ethernet	1 x 10/100/1000 Mbps (Intel® i219-LM)
Display	2 x DDI (DP/HDMI/DVI) 1 x LVDS (eDP optional)
GPIO	4-IN & 4-OUT
Audio	HD link interface to baseboard for Codec
Storage	3 x SATA-600
Expansion	6 lanes of PCI Express Gen. 3.0
Others	1 x LPC interface 1 x SPI interface 1 x I2C interface Vibration 3.5 Grms TPM 1.2
Battery	N/A
Power Input	ATX: +12V, +5VSB AT: +12V
Watchdog Timer	65536 levels, 0 to 65535 sec.
Hardware Monitoring	Yes
Operating Temperature	-40°C to +85°C (-40°F to +185°F)
Relative Humidity	10% to 95% relative humidity, non-condensing
Vibration	3.5 Grms
Dimensions	95 x 95 mm
Board Thickness	2.0 mm
Certifications	CE

 

CEM521
COM Express Type 6 Compact Module with 8th Gen Intel® Core™ & Celeron® Processor

Features

• 7th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Kaby Lake-U)
• 2 DDR4-2133 SO-DIMM for up to 32GB of memory
• Max. up to 6 lanes of PCI Express
• 3 SATA-600
• 4 USB 3.0 and 8 USB 2.0
• TPM 1.2 supported
• AXView 2.0 intelligent remote management software

Specifications
 

CPU	Intel® Core™ i7-7600U/i5-7300U/i3-7100U processor (Kaby Lake-U) & Intel® Celeron® processor 3965U
Chipset	SoC integrated
System Memory	2 x 260-pin SO-DIMM DDR4-2133, up to 32GB
BIOS	AMI
Serial	2 x TX/RX
USB	4 x USB 3.0 8 x USB 2.0
Ethernet	1 x 10/100/1000 Mbps (Intel® i219-LM)
Display	2 x DDI (DP/HDMI/DVI) 1 x LVDS (eDP optional)
GPIO	4-IN & 4-OUT
Audio	HD link interface to baseboard for Codec
Storage	3 x SATA-600
Expansion	6 lanes of PCI Express Gen. 3.0
Others	1 x LPC interface 1 x SPI interface 1 x I2C interface Vibration 3.5 Grms TPM 1.2
Battery	N/A
Power Input	ATX: +12V, +5VSB AT: +12V
Watchdog Timer	65536 levels, 0 to 65535 sec.
Hardware Monitoring	Yes
Operating Temperature	-40°C to +85°C (-40°F to +185°F)
Relative Humidity	10% to 95% relative humidity, non-condensing
Vibration	3.5 Grms
Dimensions	95 x 95 mm
Board Thickness	2.0 mm
Certifications	CE