| Customization: | Available |
|---|---|
| Main Chipset: | Intel |
| Maximum Memory Capacity: | 256GB |
|
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Ordering Information
| MD72-HB3 | Gigabyte E-ATX Dual LGA4189 Intel 3th Xeon Series C621A 16 DDR4-3200 RDIMM 3xSlimSAS 6xPCIe Gen4 x16 2*GLAN(Intel I210-AT) |
| MD72-HB2 | Gigabyte E-ATX Dual LGA4189 Intel 3th Xeon Series C621A 16 DDR4-3200 RDIMM 3xSlimSAS 6xPCIe Gen4 x16 2*10GLAN(Intel X710-AT2) 2*GLAN(Intel I210-AT) -EOL |
| MD72-HB1 | Gigabyte E-ATX Dual LGA4189 Intel 3th Xeon Series C621A 16 DDR4-3200 RDIMM 3xSlimSAS 6xPCIe Gen4 x16 2*GLAN(Intel I210-AT) |
| MU92-TU0 | Gigabyte E-ATX Dual LGA4189 Intel 3th Xeon W-3300 Series SC621A 6 DDR4-3200 RDIMM 2xSlimSAS 7xPCIe Gen4x16 2*10GLAN(Intel X710-AT2)-EOL |
| MU92-TU1 | Gigabyte E-ATX Dual LGA4189 Intel 3th Xeon Series C621A 16 DDR4-3200 RDIMM 2xSlimSAS 7xPCIe Gen4x16 2*10GLAN(Intel X710-AT2) |
| MU72-SU0 | Gigabyte E-ATX LGA4189 Intel 3th Xeon W-3300 Series C621A 8 DDR4-3200 RDIMM 3xSlimSAS 7xPCIe Gen4x16 2*GLAN(Intel I210-AT) |
MD72-HB3(rev. 1.x)
Intel® C621A Chipset
Main Features
1. 3rd Gen. Intel® Xeon® Scalable Processors
2. Dual processor, 10nm technology
3. 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
4. Supports Intel® Optane™ Persistent Memory 200 series
5. Intel® C621A Chipset
6. 2 x 1Gb/s LAN ports (Intel® I210-AT)
7. 1 x Dedicated management port
8. 2 x 7-pin SATA 6Gb/s ports
9. 3 x SlimSAS with 12 x SATA 6Gb/s ports
10. 2 x M.2 slots with PCIe Gen4 x4 interface
11. 6 x PCIe Gen4 x16 expansion slots
MD72-HB2
Intel® C621A Chipset
Main Features
1. 3rd Gen. Intel® Xeon® Scalable Processors
2. Dual processor, 10nm technology
3. 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
4. Supports Intel® Optane™ Persistent Memory 200 series
5. Intel® C621A Express Chipset
6. 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
7. 2 x 1Gb/s LAN ports (Intel® I210-AT)
8. 1 x Dedicated management port
9. 2 x 7-pin SATA 6Gb/s ports
10. 3 x SlimSAS with 12 x SATA 6Gb/s ports
11. 2 x M.2 slots with PCIe Gen4 x4 interface
12. 6 x PCIe Gen4 x16 expansion slots
MD72-HB1
Intel® C621A Chipset
Main Features
1. 3rd Gen. Intel® Xeon® Scalable Processors
2. Dual processor, 10nm technology
3. 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
4. Supports Intel® Optane™ Persistent Memory 200 series
5. Intel® C621A Chipset
6. 2 x 1Gb/s LAN ports (Intel® I210-AT)
7. 1 x Dedicated management port
8. 2 x 7-pin SATA 6Gb/s ports
9. 3 x SlimSAS with 12 x SATA 6Gb/s ports
10. 2 x M.2 slots with PCIe Gen4 x4 interface
11. 6 x PCIe Gen4 x16 expansion slots
MU92-TU1
Intel® C621A Chipset
Main Features
1. 3rd Gen. Intel® Xeon® Scalable Processors
2. Intel® Xeon® W-3300 Processor Family
3. Single processor, 10nm technology
4. 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
5. Supports Intel® Optane™ Persistent Memory 200 series
6. Intel® C621A Chipset
7. 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
8. 1 x Dedicated management port
9. 2 x 7-pin SATA 6Gb/s ports
10. 2 x SlimSAS with 8 x SATA 6Gb/s ports
11. 1 x M.2 slot with PCIe Gen3 x4 interface
12. 7 x PCIe Gen4 x16 expansion slots
MU92-TU0
Intel® C621A Chipset
Main Features
1. 3rd Gen. Intel® Xeon® Scalable Processors
2. Intel® Xeon® W-3300 Processor Family
3. Single processor, 10nm technology
4. 8-Channel RDIMM/LRDIMM DDR4 per processor, 16 x DIMMs
5. Supports Intel® Optane™ Persistent Memory 200 series
6. Intel® C621A Chipset
7. 2 x 10Gb/s BASE-T LAN ports (Intel® X710-AT2)
8. 1 x Dedicated management port
9. 2 x 7-pin SATA 6Gb/s ports
10. 2 x SlimSAS with 8 x SATA 6Gb/s ports
11. 1 x M.2 slot with PCIe Gen3 x4 interface
12. 7 x PCIe Gen4 x16 expansion slots
Product Specifications
Board Size
E-ATX
305W x 330D (mm)
Processor Supported
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor, 10nm technology
CPU TDP up to 270W
Socket
2 x LGA 4189
Socket P+
Chipset Description
Intel® C621A Chipset
Memory Type
16 x DIMM slots
DDR4 memory supported only
8-channel memory architecture per processor
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
Integrated Network
2 x 1Gb/s LAN ports (Intel® I210-AT)
1 x 10/100/1000 management LAN
Integrated Video Controller
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Integrated Audio Controller
N/A
Integrated SAS Controller
N/A
Integrated SATA Controller
2 x 7-pin SATA 6Gb/s ports
3 x SlimSAS with 12 x SATA 6Gb/s ports
Support RAID Function
Intel® SATA RAID 0/1/10/5
Expansion Slot
Slot_6: 1 x PCIe x16 (Gen4 x16 bus) slot, from CPU_0
Slot_5: 1 x PCIe x16 (Gen4 x16 bus) slot, from CPU_1
Slot_4: 1 x PCIe x16 (Gen4 x16 bus) slot, from CPU_1
Slot_3: 1 x PCIe x16 (Gen4 x16 bus) slot, from CPU_0
Slot_2: 1 x PCIe x16 (Gen4 x16 bus) slot, from CPU_0
Slot_1: 1 x PCIe x16 (Gen4 x16 bus) slot, from CPU_1
2 x M.2 slots:
- M-key
- PCIe Gen4 x4, from CPU_0
- Supports NGFF-2280/22110 cards
On-Board Connector
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
1 x 6-pin PCIe power connectors
3 x SlimSAS connectors
2 x 7-pin SATA connectors
2 x M.2 slots
1 x HDD backplane board header
2 x CPU fan headers
5 x System fan headers
1 x USB 3.0 header
1 x TPM header
1 x VROC connector
1 x Front panel header
1 x PMBus connector
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
1 x Case open header
Rear I/O Connectors
2 x USB 3.0
1 x VGA
1 x COM (RJ45 type)
2 x RJ45
1 x MLAN
1 x ID button with LED
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
OS Driver Supported
Win Server 2016
Win Server 2019
Win Server 2022
Red Hat Enterprise Linux 7.9 (x64) or later
Red Hat Enterprise Linux 8.2 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
SUSE Linux Enterprise Server 12 SP5 (x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update2 or later
VMware ESXi 8.0 or later
Citrix Hypervisor 8.2.0 or later
Server Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
PSU Connector
1 x 24-pin ATX main power connector
2 x 8-pin ATX 12V power connectors
1 x 6-pin PCIe power connector
Operating Properties
Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Bundle
1 x MD72-HB3
1 x I/O shield
1 x Quick start guide
1 x SlimSAS for 4 x SATAIII 6Gb/s cable
Single Box dimensions: 409 x 355 x 78 mm
Carton dimensions: 729 x 415 x 432 mm
Quantity: 10 x single boxes in one carton
Bulk Packaging Content
10 x MD72-HB3
10 x I/O shields
Carton dimensions: 600 x 473 x 517 mm
Ordering Information
Retail: 9MD72HB3MR-00
Bulk: 9MD72HB3NR-00
Part numbers:
- Fan-sink: 25ST4-353203-M1R (optional)
- I/O shield: 12AIO-MD72HB-10R
- SlimSAS for 4 x SATAIII 6Gb/s cable: 25CFM-600800-A4R
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