Customization: | Available |
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Integrated Graphics: | Integrated Graphics |
Main Chipset: | Intel |
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Advantech Embedded Industrial Motherboards expansion card MIOE-110 MI/O Extension Modules 4 x RS232/422/485 2 x RS422/485 8-bit GPIO
MIOe-110F-00A1E 2 x RS-232/422/485, 2 x RS-232, w/ isolation, 2 x USB MIOe-110L-00A1E 1 x RS-232/422/485, 2 x RS-232, w/o isolation, 2 x USB |
MIOe-110 2 x RS-232, 2 x RS-232/422/485 (with power and isolation), 2 x USB 2.0 |
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Specifications | |
General | |
Bus Interface | MIOe LPC/USB |
Super I/O | SCH3106 |
Rear I/O | |
COM port | COM1/2: Both at coastline and internal box wafer, simultaneously COM1: RS-232/422/485 (With isolation. RS-485 with auto flow control). COM2: RS-232/422/485 (Supports wake on ring. Supply 5V/12V power selected by jumper. RS-485 with auto flow control) |
Internal I/O | |
COM port | COM3/4: RS-232 (Support wake on ring) |
USB 2.0 | 2 |
Communications | |
Data Bits | 5, 6, 7, 8 |
Data Signals | RS-422: TxD+, TxD-, RxD+, RxD RS-485: DATA+, DATA RS-232: TxD, RxD, RTS, CTS, DTR, DSR, DCD, RI, GND |
IRQ | Depends on MI/O CPU Board |
Parity | even, odd, sticky or no |
Speed | 50 to 115.2k Baud |
Stop Bits | 1, 1.5, 2 |
Protection | |
ESD | Air gap ±15kV and contact ±8kV for all COM ports |
Isolation | 2.5kV for COM1 |
Compatibility | |
Rear I/O | MI/O-Ultra |
Mechanical | MI/O-Ultra |
Function | MI/O-Compact*, MI/O-Ultra* |
Environment | |
Dimensions | 100 x 72 mm (3.9" x 2.8") |
Weight | 0.04 kg (0.09lb), only for board |
Operational Temperature | 0 ~ 60° C (32 ~ 140° F) |
Operational Humidity | 40° C @ 95% RH Non-Condensing |
Storage Environment | (-40° C ~ 85° C) and 60° C 95% RH A52on-Condensing |
Power | |
Power Supply Voltage | Supported by MI/O Extension SBC |