Supermicro X13deh X13deg-R X13deg-M X13deg-Ma Server Motherboard with LGA-4677 Socket E Intec741 DDR5 18*Pcle5.0 Mclox8

Product Details
Customization: Available
Integrated Graphics: Integrated Graphics
Main Chipset: Intel
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  • Supermicro X13deh X13deg-R X13deg-M X13deg-Ma Server Motherboard with LGA-4677 Socket E Intec741 DDR5 18*Pcle5.0 Mclox8
  • Supermicro X13deh X13deg-R X13deg-M X13deg-Ma Server Motherboard with LGA-4677 Socket E Intec741 DDR5 18*Pcle5.0 Mclox8
  • Supermicro X13deh X13deg-R X13deg-M X13deg-Ma Server Motherboard with LGA-4677 Socket E Intec741 DDR5 18*Pcle5.0 Mclox8
  • Supermicro X13deh X13deg-R X13deg-M X13deg-Ma Server Motherboard with LGA-4677 Socket E Intec741 DDR5 18*Pcle5.0 Mclox8
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Basic Info.

Model NO.
X13DEH, X13DEG-R, X13DEG-M, X13DEG-MA
Maximum Memory Capacity
256GB
Structure
Proprietary
Memory
DDR5
SATA Interface
SATA3.0
CPU Socket
Socket E(LGA-4677)
Main Board Structure
Integrated
with CPU
No
Fsb/Ht
5600/5200/4800/4400/4000 MHz
CPU Type
5th/4th Gen Intel Xeon Scalable
Item Condition
New
Chipsetmanufacturer
Intel
Products Status
New
Package
Yes
Application
Server
Transport Package
Std
Specification
plastics, iron
Trademark
Supermicro
Origin
China
Production Capacity
1000pieces Per Year

Product Description

Supermicro X13deh X13deg-R X13deg-M X13deg-Ma Server Motherboard with LGA-4677 Socket E Intec741 DDR5 18*Pcle5.0 Mclox8

X13DEH(For SuperServer Only)

Key Features
1. Support HBM and CXL
2. 5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
3. Intel C741® Chipset
4. Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots
5. 20 PCIe 5.0 MCIO x8
6. Modular BMC AST2600
7. 1 USB 2.0
8. 2 M.2
9. 1 Sideband to I/O module via SlimSAS x8
10. 1 SATA3 port via SlimSAS-LP x8

Optimized Servers
SYS-221GE-NR
 
 
X13DEG-R(For SuperServer Only)

Key Features
1. 5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
2. Intel® C741 Chipset
3. Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots
4. 18 PCIe 5.0 MCIO x8 (8 for GPU Module; 8 for Riser Card; 2 for NVMe)
5. Dual LAN with Intel X710 10GbE
6. 2 PCIe 3.0 x4 Hybrid M.2
7. 1 VGA via AOM Card
8. 4 SATA3 port s via SlimSAS-LP x4
9. 2 USB 3.0 via AOM Card + 1 USB 3.0 onboard

Optimized Servers
SYS-221GE-TNHT-LCC
 
 
X13DEG-M(For SuperServer Only)

Key Features
1. Support HBM
2. 5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
3. Intel C741® Chipset
4. Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots
5. 12 PCIe 5.0 MCIO x8

Optimized Servers
SYS-421GE-TNHR2-LCC
 
 
X13DEG-MA

Key Features
1. Support HBM
2. 5th/4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max series processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
3. Intel C741® Chipset
4. Up to 8TB 3DS ECC RDIMM, DDR5-5600MT/s in 32 DIMM slots
5. 12 PCIe 5.0 MCIO x8

Optimized Servers
SYS-821GE-TNMR2

Specifications
Product SKUs
MBD-X13DEH
Physical Stats
Form Factor Proprietary
Dimension 12" x 16.5" (30.48cm x 41.91cm)
Processor
CPU 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors and Intel® Xeon® Max Series processors
Dual Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP
Core Up to 64 cores
System Memory
Memory Capacity 32 DIMM slots
Up to 8TB ECC RDIMM, DDR5-5600MT/s
Memory Type 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM Up to 256GB of memory with speeds of up to 5600MT/s(1DPC) or 4400 MT/s (2DPC)
DIMM Sizes   16GB, 32GB, 64GB, 96(XCC Only)GB, 128GB, 256GB
RDIMM: Up to 256GB
Memory Voltage  1.1V
On-Board Devices
Chipset     Intel® C741
SATA Intel® C741 controller for 1 PCIe 5.0 x8 ports
Network Controllers N/A
Input / Output
SATA 1 SATA3 port(s)
USB 1 USB 2 port(s) (1 via header)
TPM 1 TPM Header
Expansion Slots
PCIe   20 PCIe 5.0 x8 PCIe5.0 MCIO connector,
1 PCIe 5.0 x8 SlimSAS, For IO board for USB/DP/LAN
M.2   M.2 Interface: 2 PCIe 3.0 x2
Form Factor: 2280, 22110
Key: M-Key
System BIOS
BIOS Type AMI 64MB AMI UEFI
BIOS Features ACPI 6.4
SMBIOS 2.8/3.5
UEFI 2.8A
Plug and Play (PnP)
PCI FW 3.2
Management
Software  Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
PC Health Monitoring
Voltage  VBAT, System level control, Supports system management utility, Monitors CPU voltages, Chipset Voltage, Chassis intrusion header, 5 -fan status, +5V standby, +5V, +3.3V, +12V, Memory Voltages
LED UID/Remote UID
CPU / System Overheat LED
Temperature Monitoring for CPU and chassis environment
CPU thermal trip support
Thermal Monitor 2 (TM2) support
PECI
FAN  12x 8-pin fan headers (up to 12 fans)
Fan speed control
5 fans with tachometer status monitoring
Overheat LED indication
Other Features UID, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, Chassis intrusion detection, ACPI power management
Operating Environment
Operating Temperature Range  10°C - 35°C (50°F - 95°F)
Non-Operating Temperature Range  -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range 8% - 90% (non-condensing)
Non Operating Relative Humidity Range 5% - 95% (non-condensing)

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