Imb700 ATX Motherboard with LGA4189 Socket 3rd Gen Intel Xeon for Axiomtek

• Customization: Available
• Integrated Graphics: Integrated Graphics
• Main Chipset: Intel
• Model NO.: IMB700-S
• Maximum Memory Capacity: 384GB
• Structure: ATX
• Memory: DDR4
• SATA Interface: SATA3.0
• CPU Socket: LGA4189
• Main Board Structure: Integrated
• Audio Effects: Not HiFi
• Fsb/Ht: 3200MHz
• Item Condition: New
• Products Status: New
• Package: Yes
• Transport Package: Yes
• Specification: std
• Trademark: Axiomtek
• Origin: China
• Production Capacity: 1000pieces Per Year

Product Description

 

Product Description

IMB700

ATX Motherboard with LGA4189 Socket 3rd Gen Intel® Xeon® Scalable Processors, Intel® C621A, 3 PCIe x16, 3 PCIe x8, VGA, and NVMe

 

Ordering Information

• IMB700-S (P/N-E38F700101)
• ATX Motherboard with LGA4189 socket 3rd gen Intel® Xeon® scalable processors, Intel® C621A, 3 PCIe x16, 3 PCIe x8, VGA, and NVMe
• 5938A808010E
• 2 x USB 2.0 cable with bracket, P=2.54 mm, L=190 mm
• 5938A808020E
• 2 x USB 2.0 cable with bracket, P=2.54 mm, L=400 mm
• 83935151000E
• TPM 2.0 module (AX93515)
• E393242100
• AX93242-RC HD audio converter kit
• 5948C122800E
• 2 x USB 3.1 Gen1 cable with bracket, L=400 mm
• 593826A0000E
• SATA signal cable/red, L=500 mm
• 713WFB30000E
• IMB700_CL_LGA4189_4U_CPU above 205W
• 713JYC1M000E
• IMB700_CL_LGA4189_2U_CPU under 205W

Features
3rd gen Intel® Xeon® Scalable processors (Ice Lake-SP)
Six 288-pin DDR4-3200 RDIMM for up to 384GB of memory
3 PCIe x1 and 3 PCIe x8
Supports M.2 Key M
TPM 2.0 supported (optional)
Supports multiple graphic cards
Supports internal USB dongle

Introduction
The IMB700 is powered by the latest dual LGA4189 socket 3rd Gen Intel® Xeon scalable processors (code name: Ice Lake-SP) with the Intel® C621A chipset. The IMB700 offers rich expandability with three PCIe x16 slots, three PCIe x8 slots and M.2 Key M 2280 interface with PCIe x4 signal for adding GPUs, capture cards, RAID cards, high-speed NVMe storage, etc. Six SATA-600 ports with integrated RAID 0/1/5/10 are available for reliable data storage and protection. For a wide range of I/Os, it has an internal USB dongle, six USB 3.1 Gen1 ports, seven USB 2.0 ports, one RS-232/422/485 port, two GbE LAN ports with Intel® Ethernet controller i210-AT, one VGA port, eight-channel programmable digital I/O port, one HD Codec audio, SMBus, and one PS/2 keyboard and mouse. Trusted Platform Module 2.0 (TPM 2.0) is available to ensure critical information security. Furthermore, it can operate under a wide temperature range from 0°C to +60°C for use in harsh environments. More features include watchdog timer and hardware monitoring functions. Featured with built-in AI and crypto acceleration functions as well as advanced security capabilities, the IMB700 is targeted at markets requiring accelerating performance, high security, high-performance computing for efficient machine and deep learning workloads.

Specification

CPU	3rd gen Intel® Xeon® Scalable processors (TDP up to 270W)
Chipset	Intel® C621A
System Memory	6 x DDR4-3200 R-DIMM ECC memory, up to 384GB
BIOS	AMI
COM	1 x RS-232/422/485 (rear I/O)
USB	4 x USB 3.1 Gen1 (rear I/O) 2 x USB 3.1 Gen1 (internal box header) 6 x USB 2.0 (internal box header) 1 x USB 2.0 (180D TypeA)
Ethernet	2 x 10/100/1000 Mbps Ethernet (Intel® i210-AT)
Display	1 x VGA
Digital I/O	8-channel programmable
Audio	HD Codec audio as MIC-in/Line-in/Line-out/Speaker-out with audio kit AX93242 (optional)
Storage	6 x SATA-600 with RAID 0/1/5/10 M.2 key M 2280 slot with PCIe x4 signal
Expansion	3 x PCIe x8 3 x PCIe x16
Others	1 x PS/2 keyboard and mouse
Battery	TBD
TPM	TPM 2.0 module (optional)
Watchdog Timer	255 levels, 1 to 255 sec.
Hardware Monitoring	Yes
Operating Temperature	0°C to +60°C (+32°F to +140°F)
Relative Humidity	10% to 95% relative humidity, non-condensing
Dimensions	305 x 244 mm
Board Thickness	1.6 mm
Certifications	CE