COM Express Type 7 Motherboard Cem700 Cem710 Intel Xeon for Axiomtek

• Customization: Available
• Integrated Graphics: Integrated Graphics
• Main Chipset: Intel
• Model NO.: CEM700, CEM710
• Maximum Memory Capacity: 64G
• Structure: COM Express Type 7
• Memory: DDR4
• SATA Interface: SATA3.0
• Printed Circuit Board: Double Layers
• Main Board Structure: CPU Based
• Audio Effects: Not HiFi
• with CPU: Yes
• Socket Type: Onboard CPU
• Chipset: Soc Integrated
• Memory Channel: Double
• Products Status: New
• CPU Type: Intel
• Package: Yes
• Memory Type: DDR4
• Application: Server/Workstation
• Launch Date: 2020
• Transport Package: Std
• Specification: 125 x 95 mm
• Trademark: Axiomtek
• Origin: Beijing, China
• Production Capacity: 1000pieces Per Year

Product Description

Ordering Information

CEM700
CEM700-D1577 (P/N-E38D700100)
COM Express Type 7 Basic module with Intel Xeon D-1577, 10GBASE-KR, USB 3.0 and TPM
CEM700-D1539 (P/N-E38D700102)
COM Express Type 7 Basic module with Intel Xeon D-1539, 10GBASE-KR, USB 3.0, and TPM (Ind. Temp)
CEM700-D1527 (P/N-E38D700101)
COM Express Type 7 Basic module with Intel Xeon D-1527, 10GBASE-KR, USB 3.0 and TPM
CEM700-D1519 (P/N-E38D700103)
COM Express Type 7 Basic module with Intel Pentium D-1519, 10GBASE-KR, USB 3.0, and TPM (Ind. Temp)
CEM700-D1508 (P/N-E38D700104)
COM Express Type 7 Basic module with Intel Pentium D-1508, 10GBASE-KR, USB 3.0 and TPM
CEB94701 (P/N-E394701100)
COM Express Type 7 development board
E39J012100
CEM700 heatpipe cooler
7128D700000E
CEM700 heat spreader
 

CEM700

• CEM710-D1712TR
• COM Express Type 7 basic module with Intel® Xeon® D-1712TR, 10GBASE-KR, USB 3.0, and TPM
• CEM710-D1715TER
• COM Express Type 7 basic module with Intel® Xeon® D-1715TER, 10GBASE-KR, USB 3.0, and TPM
• CEM710-D1732TE
• COM Express Type 7 basic module with Intel® Xeon® D-1732TE, 10GBASE-KR, USB 3.0, and TPM
• CEM710-D1735TR
• COM Express Type 7 basic module with Intel® Xeon® D-1735TR, 10GBASE-KR, USB 3.0, and TPM
• CEM710-D1746TER
• COM Express Type 7 basic module with Intel® Xeon® D-1746TER, 10GBASE-KR, USB 3.0, and TPM
• CEB94701 (P/N-E394701100)
• COM Express Type 7 development board
• CEM710 heat pipe cooler
• CEM710 heat spreader

Product Description

CEM700
COM Express Type 7 Basic Module with Intel Xeon D-1500 & Pentium Processor D1500

 

Features
Intel Xeon D-1500 and Pentium Processor D1500 (Broadwell-DE)
2 DDR4-2400 SO-DIMM for up to 64GB of memory
1 PCIe x16 Gen3, 1 PCIe x8 Gen3, 8 PCIe x1 Gen2
2 SATA-600
4 USB 3.0 and 4 USB 2.0
Two 10GBase-KR
TPM 2.0 supported

Introduction
The CEM700 offers scalable processor options from the 16-core Intel Xeon D-1577 processor to the 4-core Intel Pentium D1519 processor (codename: Broadwell DE). This COM Express Type 7 module comes with two 10GBASE-KR channels and supports two DDR4-2400 SO-DIMM slots for up to 32GB system memory. It delivers powerful server-class performance in a small form factor of 125 x 95 mm. Axiomtek's CEM700 is well-suited for integration into compute-intensive and space-constrained applications in need of high data and network throughputs, such as edge computing, microserver, data transmission device, and other networking fields. The Axiomtek's CEM700 incorporates two 10GBASE-KR interfaces and an NC-SI (Network Controller Sideband Interface) for remote management to fulfill server application demands. The Intel Broadwell DE-based module has a wide operating temperature range from -20ºC to +70ºC (or optionally -40ºC to +85ºC) to fully serve the needs of diverse applications. To enable fast turnkey evaluation, Axiomtek also provides CEB94701, the COM Express type 7 baseboard to operate with CEM700. Customers can quickly emulate the functionality for software development and hardware verification.

Specifications
 

CPU	Intel® Xeon® D-1577 1.3/2.1GHz 24MB, 45W (16C) Intel® Xeon® D-1539 1.6/2.2GHz 12MB, 35W (8C) Intel® Xeon® D-1527 2.2/2.7GHz 6MB, 35W (4C) Intel® Pentium® D1519 1.5/2.1GHz 6MB, 25W (4C) Intel® Pentium® D1508 2.2/2.6GHz 3MB, 25W (2C)
Chipset	SoC integrated
System Memory	2 x 260-pin DDR4-2400 ECC SO-DIMM, up to 64GB
BIOS	AMI
Serial	2 x TX/RX
USB	4 x USB 3.0 4 x USB 2.0
Ethernet	1 x 10/100/1000 Mbps Ethernet (Intel® i210) 2 x 10GBASE-KR with Intel® 10G external PHY
Display	N/A
GPIO	4-CH in & 4-CH out
Audio	N/A
Storage	2 x SATA-600
Expansion	1 x PCIe x16 Gen3 1 x PCIe x8 Gen3 8 x PCIe x1 Gen2
Others	1 x I2C 1 x LPC 1 x SPI TPM 2.0 SMBus
Battery	N/A
Power Input	ATX: +12V, +5VSB AT: +12V
Watchdog Timer	65536 levels, 0 to 65535 sec.
Hardware Monitoring	Yes
Operating Temperature	Industrial: -40°C to +}85°C (-40°F to +185°F) Standard: 0°C to +60°C (+32°F to +140°F)
Relative Humidity	10% to 95% relative humidity, non-condensing
Vibration	3.5 Grms
Dimensions	125 x 95 mm
Board Thickness	2.0 mm
Certifications	CE

CEM710
COM Express Type 7 Basic Module with Intel® Xeon® D-1700 Series Processor
 

Features

• Intel® Xeon® D-1700 series processor (Ice Lake D)
• 2 DDR4-2400 SO-DIMM for up to 64 GB memory
• 1 PCIe x16 Gen3 (PEG), 1 PCIe x8 Gen3, and 6 PCIe x1 Gen3
• 2 SATA Gen3
• 4 USB 3.0 and 4 USB 2.0
• 4 10GBase-KR
• Supports TPM 2.0

 

Specifications

CPU	Intel® Xeon® D-1712TR (4 x 2.0 GHz, 10MB cache, 50G Eth, 40W) Intel® Xeon® D-1715TER (4 x 2.4 GHz, 10MB cache, 50G Eth, 50W) Intel® Xeon® D-1732TE (8 x 1.9 GHz, 15MB cache, 50G Eth, 52W) Intel® Xeon® D-1735TR (8 x 2.2 GHz, 15MB cache, 50G Eth, 59W) Intel® Xeon® D-1746TER (10 x 2.0 GHz, 15MB cache, 100G Eth, 67W)
Chipset	SoC integrated
System Memory	2 x 260-pin DDR4-2400 SO-DIMM, up to 64GB with ECC support
BIOS	AMI
Serial	2 x TX/RX
USB	4 x USB 3.0 4 x USB 2.0
Ethernet	1 x 10/100/1000/2500 Mbps with Intel® I226, configured through COMe PCIe port 7 4 x 10GBASE-KR with Intel® 10G external PHY
Display	N/A
GPIO	4-CH in & 4-CH out
Audio	N/A
Storage	2 x SATA Gen3
Expansion	1 x PCIe x16 Gen3 (PEG) 1 x PCIe x8 Gen3 6 x PCIe x1 Gen3
Others	TPM 2.0 1 x I2C 1 x LPC 1 x SPI
Battery	N/A
Power Input	ATX: +12V, +5VSB AT: +12V
Watchdog Timer	65536 levels, 0 to 65535 sec.
Hardware Monitoring	Yes
Operating Temperature	Standard: 0°C to 60°C (32°F to 140°F) Extended: -40°C to 85°C (-40°F to 185°F) with system thermal solution
Relative Humidity	10% to 95% relative humidity, non-condensing
Vibration	3.5 Grms
Dimensions	125 x 95 mm
Board Thickness	2.0 mm
Certifications	CE