He-B73 Intel Qm580/RM590e Core I7 Onboard Displayport 6xcom Motherboard for Commell

• Customization: Available
• Integrated Graphics: Integrated Graphics
• Main Chipset: Intel
• Model NO.: HE-B7371, HE-B7374
• Maximum Memory Capacity: 64G
• Structure: Half-Size Picmg 1.3
• Memory: DDR4
• SATA Interface: SATA3.0
• CPU Socket: Fcbga1787
• Printed Circuit Board: Double Layers
• Main Board Structure: Integrated
• Audio Effects: HiFi
• with CPU: Yes
• Chipset Manufacturer: Intel
• Socket Type: Onboard CPU
• Fsb/Ht: 533/667MHz
• Witn CPU: Yes
• Maximum RAM Capacity: 3.5GB
• Hard Drive Interface: SATA
• Item Condition: New
• Memory Channel: Double
• Products Status: New
• Memory Bank: 2DDR2DIMM
• Package: Yes
• Private Mold: Yes
• Application: Server/Workstation
• Transport Package: Yes
• Specification: 168 mm x 126 mm
• Trademark: COMMELL
• Origin: Bj. Cn
• Production Capacity: 1000pieces Per Year

Product Description

Product Description

HE-B73
Half-size / PICMG 1.3 support Tiger Lake 11th Gen H Processor

 

Support Intel® Tiger Lake 11th Gen H Processor.
Intel® QM580/RM590E chipset, onboard DisplayPort, VGA, LVDS & DVI, DDR4 up to 64 GB,
1 x Giga PHY LAN, 1 x 2.5Giga LAN, 4 x USB 2.0, 2 x USB 3.2 Gen2 (Type E), 6 x COM,
2 x SATA3, HD Audio, GPIO, 1 x Mini-PCIe with SIM slot (support mSATA), 1 x M.2 (Key E 2230),
1 x M.2 (Key M 2280), expansion 1 x PCIe X16, 4 x PCIe X1 or 1 x PCIe X4.

  

Key Feature

• CPU: Intel® Tiger Lake 11th Gen H Processor.
• Chipset: Intel® QM580E / RM590E.
• Memory: 2 x DDR4 SO-DIMM 3200MHz up to 64GB.
• DisplayPort interface: Onboard DisplayPort connector.
• VGA interface: Onboard 2x8 pin-header.
• LVDS interface: Onboard LVDS connector.
• DVI interface: Onboard DVI pin-header.
• LAN Interface: 2 x RJ45 LAN.
• Serial ATA: 2 x SATA3.
• Audio: High Definition Audio.
• Internal I/O: 2 x RS232/422/485, 4 x RS232, 1 x SMBus, 1 x GPIO, 4 x USB2.0, 2 x USB3.2 Gen2 (Type E), 1 x DVI, 1 x LVDS, 1 x LCD inverter, 1 x Audio, 2 x Serial ATA3.
• Rear I/O: 1 x DisplayPort, 2 x LAN, 1 x PS/2.
• Expansion: 1 x MiniPCIe with SIM slot (support mSATA), 1 x M.2 2280 Key M, 1 x M.2 2230 Key E, 1 x PCIe X16, 4 x PCIe X1 or 1 x PCIe X4.
• GPIO interface: 8-bit Digital I/O interface.
• Power requirement: Standard 24-pin ATX power from Backplane.

 

Specification

Form Factor	Half-size PICMG 1.3 CPU card
Processor	Intel® Tiger Lake 11^th Gen H Processor Package Type: FCBGA1787
Memory	2 x DDR4 SO-DIMM 3200 MHz up to 64GB, support Non-ECC, unbuffered memory (TGL-H Xeon CPUs can support ECC memory)
Chipset	Mobile Intel® QM580E / RM590E chipset
Real Time Clock	Chipset integrated RTC with onboard lithium battery
Watchdog Timer	Generates a system reset with internal timer for 1min/s ~ 255min/s
Serial ATA Interface	2 x SATAIII interface up to 600MB/s
DisplayPort interface	Onboard DisplayPort connector
Integrated Graphics	Intel® 11th Gen integrated UHD Graphics
LVDS Interface	Onboard 18/24-bit dual channel LVDS connector with +3.3V/+5V/+12V supply
VGA Interface	Onboard 2x8 pin-header
DVI Interface	Onboard 15-pin DVI interface
Audio Interface	Realtek ALC888S HD Audio
LAN Interface	1 x Intel® I219-LM Gigabit LAN (Support Intel® AMT 15.0) 1 x Intel® I225-LM Gigabit LAN (Up to 2.5GbE)
GPIO Interface	Onboard programmable 8-bit digital I/O interface
Expansion	1 x MiniPCIe with SIM slot (support mSATA) 1 x M.2 Key M 2280 support PCIe Gen4 and SATA 1 x M.2 Key E 2230 for Wi-Fi and Bluetooth 1 x PCIe X16 4 x PCIe X1 or 1 x PCIe X4
Internal I/O Port	2 x RS232/422/485, 4 x RS232, 1 x SMBus, 1 x GPIO, 2 x USB3.2 Gen2 (Type E), 4 x USB2.0, 1 x VGA, 1 x DVI, 1 x LVDS, 1 x LCD inverter, 2 x Serial ATA3 and 1 x Audio
External I/O Port	2 x LAN, 1 x DisplayPort and 1 x PS/2
Power Requirement	Standard 24-pin ATX power from Backplane
Board Dimension	168 mm x 126 mm (L x W)
Temperature	Operating within 0 ~ 60°C (32°F ~ 140°F) (Note1) Storage within -20 ~ 80°C (-4°F ~ 176°F)
Relative Humidity	10%~90%, non-condensing

Ordering Guide
HE-B7371	With Core^TM i7-11850HE, QM580E + Cooler fan, DisplayPort, VGA, LVDS, DVI, support PCIe X16, 4 x PCIe X1
HHE-B7374	With Core^TM i7-11850HE, QM580E + Cooler fan, DisplayPort, VGA, LVDS, DVI, support PCIe X16, 1 x PCIe X4
ADP-3355	DisplayPort to VGA module (For 2^nd VGA)
ADP-3460	DisplayPort to LVDS module (For 2^nd LVDS)
M2-3502	M2 2280 Key M support 2 x Gigabit LAN
M2-3504	M2 2280 Key M support 4 x Gigabit LAN
Note1: W-11865MRE, W-11555MRE, W-11155MRE can operate within -40°C~85°C (-40°F~185°F). Note2: If you want to use other TGL H CPU (i5-11500HE, i3-11100HE, W-11865MRE, W-11865MLE, W-11555MRE, W-11555MLE, W-11155MRE, W-11155MLE, 6600HE), please contact with our sales. Note3: There are two module ADP-3355, ADP-3460; and you can choose one to support 2^nd  VGA or 2^nd LVDS, please contact with our sales for OEM version.